Global ASIC Chip Market Expected to Be Worth $24.7 Billion by 2025. Is Your Infrastructure Ready?

By Logan Wamsley

According to a new report by KBV Research titled Global ASIC Chip Market (2019-2025), the size of the global market for application specific integrated circuits (ASICs) is expected to reach $24.7 billion by 2025, growing an average rate of 8.2% annually. As a highly-customizable chip designed for a unique job in a circuit while offering improved performance, reduced size, and increased efficiency, many OEMs are opting to incorporate ASICs into their supply chains to stand out in the marketplace and highlight their own unique IPs.

The fastest adopters of ASICs have been in the United States due to the high levels of growth for consumer products, but Europe, the Asia Pacific, Latin America, Middle East, and African markets are quickly following suit. ASICs can today be found in markets such as processing systems, consumer electronics, telecommunication systems, aerospace subsystems and sensors, medical instrumentation, and many others.

Facing such growth however, OEMs need to understand that to follow suit, one cannot simply implement ASICs overnight. It requires a thoughtful, deliberate, and long-term commitment to improving their storage infrastructures and ensuring the ASICs in question operate at peak performance at the point of assembly.

To do so, an OEM will likely need to quickly implement a process for properly storing raw die and wafer. Many ASICs are assembled only when needed, and keeping them in their die and wafer form is a cost-effective, efficient solution for ensuring the integrity of the material for years on end. This can only be accomplished, however, with the use of a specialized dry cabinet capable of maintaining precise humidity levels. Raw die is very sensitive to moisture, and any humidity level over approximately 10% for prolonged periods can be devastating to the inventory. If purchasing such a cabinet, or training staff to properly handle the inventory when needed, is not a feasible option, the use of a third party may be necessary.

Partstat offers die and wafer banking customers access to the latest technologies available, including desiccant dry cabinets capable of maintaining a relative humidity of less than 0.5%. This, along with its self-regulated drying technology, zeolite MSL regulation, and full protection from electrostatic discharge, makes Partstat’s dry cabinets the safest way to bank wafer and die in the industry, not to mention the most convenient due to handlers’ ability to access the inventory an industry-leading 10-12 times per hour. Plus, with the added protection of Partstat’s custom storage vault, all die and wafer banked with Partstat will be fully protected from fire, flood, electromagnetic inference, and all other known natural disasters.

If your organization feels the need to incorporate ASICs into your designs quickly before the global market leaves you behind, Partstat’s die and wafer banking services can help ensure your infrastructure is ready.