6 Benefits of Die and Wafer Utilization for Electronics OEMs

By Logan Wamsley

One of the most exciting developments in the electronics world over the last few years is the increased adoption of application-specific integrated circuits (ASICs), and by extension, die and wafer banking, into OEM designs across all industries and disciplines. While some may experience difficulties upgrading their infrastructure to a level suitable for die utilization, once…

The Dangers of Compromising on Electronic Component Storage

By Logan Wamsley

An equipment manufacturer can easily be judged based on how they store their critical electronic inventory. Not all manufacturers have an inherent need to store electronics, but those that do take on the added responsibility of ensuring that they work in accordance with the expectations of the engineers, as well as the consumers the company…

Who Has a Need for a Custom Storage Vault?

By Logan Wamsley

A common question we hear from potential customers interested in the use of our custom storage vault is if such a drastic measure is right for them. What organizations have a need for a 1,100 pound vault door and a steel-infused infrastructure designed to eliminate all known forms of externally-caused supply chain disruption? Is such…

Partstat Last Time Buy Solution FAQ

By Logan Wamsley

There is little doubt that our Last Time Buy Solution is one-of-a-kind in the electronics manufacturing industry, and as a result of this, we receive a lot of questions regarding how it works exactly. What is it? What makes it unique? What limitations does it have? To help alleviate these concerns, we have compiled a…

Die and Wafer Banking with Partstat Dry Cabinet Technology

By Logan Wamsley

Die and wafer banking, on a basic level, is a process that remains somewhat consistent from service provider to service provider. Essentially, when an OEM chooses to adopt ASICs or other similar electronic components into their product designs, but does not have the infrastructure in place to properly protect them from external climate conditions (particularly…