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Sometimes it’s the smallest things that have the largest impact. This is the story of the supply chain woes still being felt in the runup to the 2022 holiday season, with one of the largest struggles being the crippling supply of low-end legacy chips, sometimes known colloquially as “penny chips”. These chips can cost anywhere…
The semiconductor market is experiencing a very unique time, a time where two seemingly conflicting narratives are occurring simultaneously. On one hand, global demand and sales of chips and semiconductors have never been stronger. According to IDC, worldwide semiconductor sales grew to a mammoth $464 billion in 2020, a nearly 11% increase from 2019. Even…
As we move into 2021, it has become clear that many of the issues that plagued the previous year are not going to go away lightly. In fact, until a vaccine has had worldwide distribution, it can be expected that the current status quo will remain untouched, with high uncertainty remaining within various supply chains…
Contract electronics manufacturers, especially in today’s environment, struggle with cash flow issues. The COVID-19 pandemic has only exacerbated the need for businesses to free up what limited capital they have on hand to not just meet their production goals, but to implement critical safety measures to keep their employees safe. “[I]n a time like this,…
As 2020 comes to a close, Partstat was proud to attend the 2019 Diminishing Manufacturing Sources and Material Shortages (DMSMS)/Parts Obsolescence Symposium in Phoenix, Arizona. It was a wonderful opportunity to introduce ourselves in person to the thousands of attendees who deal with the reality of obsolescence and allocation disruption on a daily basis. Many…
The use of die banking to support long-term OEM product lifecycles is becoming more commonplace by the day. Widespread concerns regarding the current state of the electronic component market is certainly one reason for this trend, but equally responsible is the education of OEM customers – who are quickly understanding how banking die and wafer…