Overcoming the Costs of Die and Wafer Banking

By Logan Wamsley

The decision to incorporate die and wafer banking into your product designs is an easy one to make if it’s in the OEM’s capacity to do so. Not only can the custom-designed ASICs assembled during production exhibit performance enhancements on par with the best modern technology has to offer, but their narrow function also renders…

The Price OEMs Pay for IP Protection

By Logan Wamsley

The creation, marketing, and ultimately selling of a successful OEM product typically comes down to three simple factors: • Value: How much value does the product offer the consumer for the cost? This does not necessarily mean that the cheaper the product, the more successful. Instead, it’s more helpful and accurate to question what the…