The Limitations of a Product Change Notification

By Logan Wamsley

The issuance of a product change notification (PCN) from a component manufacturer has become a key part of an OEM’s production process. While each component manufacturer will have their own unique policy regarding PCNs, essentially their goal is to notify customers of an impending decision that may impact their supply chain. For example, if the…

2019 Is the Time to Consider Die and Wafer Banking

By Logan Wamsley

The silicon wafer market experienced a market boom between 2016 and 2018. In 2018 alone, silicon wafer shipments reached a record high of 12,732 million square inches (MSI), which was up 8 percent from 2018. Despite 3.6 percent market growth through 2019, however, certain areas of the silicon wafer industry have experienced a minor slowdown,…

New Expectations for BOM Monitoring Solutions

By Logan Wamsley

Nothing is immune to change in the manufacturing industry. As consumer needs change along with advancements in technology, manufacturers do not, nor do they ever, have the option of remaining idle — or at least remaining idle with the expectation of retaining market share. In order to accomplish consistent market growth, or even remain competitive,…

Benefits of a Free Electronic Component Search Engine

By Logan Wamsley

While we all love to read the word “free” and take advantage of whatever service or product is being offered, we have also grown to view the term with a degree of skepticism. By virtue of us offering the world’s largest free electronic component search engine, this is a skepticism we are used to seeing.…

6 Benefits of Die and Wafer Utilization for Electronics OEMs

By Logan Wamsley

One of the most exciting developments in the electronics world over the last few years is the increased adoption of application-specific integrated circuits (ASICs), and by extension, die and wafer banking, into OEM designs across all industries and disciplines. While some may experience difficulties upgrading their infrastructure to a level suitable for die utilization, once…