Die and Wafer Banking Costs: Prohibitive or Accessible?

By Logan Wamsley

In addition to added IP protection and ASIC performance efficiency, one of the greatest strengths of die and wafer banking is long-term cost-effectiveness. At the current rate of innovation and exponentially increasing demand, some critical components are transitioning to obsolescence before they even hit the market. To counter, if the OEM chooses to operate in…

Addressing Two Primary Concerns Associated with Die and Wafer Banking

By Logan Wamsley

When making the decision to implement ASICs into their product designs, original equipment manufacturers (OEMs) often look at the benefits ASICs can offer their supply chain. Tighter obsolescence management procedures, more secure IP protection, increases in processing speeds and efficiency, and significantly reduced assembly and packaging costs are just a few of the advantages ASICs…

The Challenge of Die and Wafer Banking: Solved

By Logan Wamsley

As technology in the electronics industry continues to evolve and accelerate at an unprecedented rate, manufacturers are being forced to adapt their tried-and-true supply chain models to confront this new reality – or risk falling behind in the race to produce the cutting-edge products consumers expect. In their efforts to combat obsolescence, for example, many…

The Rise of ASICs, and What It Means for Your Supply Chain

By Logan Wamsley

The latest industry trend taking the world (and Wall Street) by storm is cryptocurrency, or more specifically the blockchain technology used to drive it. Gartner defines a blockchain technology as ”a shared, distributed, decentralized and tokenized ledger that removes business friction by being independent of individual applications or participants.” The idea that critical, sensitive data…