Partstat Partner Newswire: Component Manufacturer Edition | August 2019
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To provide additional value to our customers and keep a pulse on the state of the industry, we offer a brief monthly post that highlights notable news and happenings going on with our valued partners.
In a recent press release, Panasonic Corporation of North America has announced a new CEO. Michael Moskowitz, who has served various roles including chairman of Panasonic Canada, Inc. and Panasonic Consumer Electronic Company, will succeed Tom Gebhardt, who is ending his tenure after 34 years with the company.
“I am humbled and excited to take on this new role,” said Moskowitz in a statement. “Panasonic Corporation of North America has successfully undergone an incredible transformation, redefining the relationships we enjoy with our B2B customers through innovation and customer centricity — cornerstones of our future success. That transformation was made possible by leaders like Tom Gebhardt, to whom we owe a debt of gratitude.”
The Japan-based conglomerate is excited by what they have seen so far in Moskowitz. “The board of directors and I are excited to see Michael lend his great energy and vision to building on the momentum that Tom has created in an increasingly important market for Panasonic,” said president Kazuhiro Tsuga. “We wish both leaders great success, and we thank Tom for his leadership and his many contributions throughout a distinguished career.”
As the transition continues, announcements of new leadership for Panasonic Canada and Panasonic Consumer Electronic Company are expected in the coming weeks.
In a laptop market that sees consumers continually pushing industry leaders to introduce thinner and more efficient models, OEMs are struggling to create designs with removable components that cater to a market that prioritizes ad hoc upgradability.
At the Flash Memory Summit held at the Santa Clara Convention Center this week, Toshiba introduced a new form factor for NVMe SSDs, titled XFMEXPRESS, that is designed to rectify this issue. Developed with the aid of Japan Aviation Electronic Industry Ltd., the cards used are just 18-by-14-by-1.4mm in size, slightly larger than a microSD card and much smaller than the M.2 NVMe SSDs relied on today for replaceable storage.
Not only will consumers be capable of upgrading the storage of their laptops on their own, laptop manufacturers will also be able to take advantage of promoting storage flexibility in upcoming laptop lines, granting consumers more choice at the point of sale.
While a release date has not been announced, Toshiba expects the new technology to be incorporated into new laptop models sometime in 2020.
Semtech and Murata
Semtech Corporation, long a leading supplier of high performance analog and mixed-signal semiconductors, has partnered with renowned electronics manufacturer Murata to introduce a new modem to the Internet of Things (IoT) market. Based on Semtech’s LoRa® devices and the LoRaWAN® protocol, this product is designed to simplify the IoT development process and increase the ROI of LoRaWAN-based solutions, according to Yahoo Finance.
“The modem integrated with Semtech’s LoRa Cloud Device & Application Services enables customers to focus on developing innovative Internet of Things (IoT) applications without worrying about underlying radio connectivity,” said Marc Pegulu, Vice President of IoT for Semtech’s Wireless and Sensing Products Group. “This new offering shortens the design and sales cycle by providing users with a secure and easy-to-deploy LoRa-based wireless modem.”
“The new LoRa-based module with an embedded modem will allow our customers to bring products to market faster than ever before,” said Samir Hennaoui, LPWA Product Manager at Murata. “The goal of this project is to provide production-ready LoRa-based hardware platforms and associated Cloud services, which abstract complexity and simplify development. We are confident that the module will also accelerate the worldwide adoption of LoRa-based devices and the LoRaWAN protocol.”
According to Murata, samples will be in production early in the fourth quarter of 2019 and be available in both Europe and North America.
Cypress and Infineon
In a recent press release, Cypress Semiconductor announced that it will hold a special meeting of stockholders on August 27, 2019 to approve the previously announced Agreement and Plan of Merger. This action provides for Infineon Technologies AG to acquire Cypress for $23.85 per share in cash, corresponding to an enterprise value of approximately $10 billion.
According to analysts, such a move makes financial sense for both parties. After the merger, Infineon stands to become the eighth-largest chip manufacturer in the world, as well as the number one supplier of chips to the automotive market. Cypress, on the other hand, despite some recent losses as the result of a weak market, estimates a compound annual growth rate for IoT of 12-14 percent and of 8-12 percent for automotive from 2019 through 2023.
“The Infineon and Cypress portfolios complement each other ideally,” said Infineon CEO Reinhard Ploss. “The acquisition will enable us to strengthen our core power semiconductor business in the long term. With Cypress, Infineon will be able to gain an even stronger foothold in important future markets and accelerate the pace of growth.”