6 Benefits of Die and Wafer Utilization for Electronics OEMs

By Logan Wamsley

One of the most exciting developments in the electronics world over the last few years is the increased adoption of application-specific integrated circuits (ASICs), and by extension, die and wafer banking, into OEM designs across all industries and disciplines. While some may experience difficulties upgrading their infrastructure to a level suitable for die utilization, once…

Featured on EBN: Component Shortages Give OEMs Cold Feet on Inventory Commitments

By Logan Wamsley

“There is little about the “Great Component Shortage of 2018” that hasn’t already been thoroughly analyzed. Unprecedented demand for smaller and more efficient passive electronics, especially in the automotive and IoT industries, has driven lead times for once commoditized components to the breaking point. What hasn’t been discussed, however, is the equal pushback OEMs are…