$75 Million Grant to Absolics: Boosting Advanced Chip Packaging in the U.S.
Enhancing U.S. Semiconductor Capabilities The U.S. government has announced a $75 million grant to Absolics, a subsidiary of South Korean glass manufacturer SKC, to develop advanced chip packaging technologies. This investment is part of a broader strategy to strengthen the domestic semiconductor industry and enhance supply chain resilience. The grant underscores the importance of advanced…
